A 5 nm ruthenium thin film as a directly plate-able copper diffusion barrier
- Citation:
- and T. N. Arunagiri, Zhang Y, Chyan* O, El-Bounani M, Kim MJ, Wu CT, Chen LC, Chen KH.
2005. A 5 nm ruthenium thin film as a directly plate-able copper diffusion barrier. Appl. Phys. Lett.. 86:083104-(1-3).
