<?xml version="1.0" encoding="UTF-8"?><xml><records><record><source-app name="Biblio" version="6.x">Drupal-Biblio</source-app><ref-type>17</ref-type><contributors><authors><author><style face="normal" font="default" size="100%">T. N. Arunagiri, , , ,,,, and</style></author><author><style face="normal" font="default" size="100%">Y. Zhang</style></author><author><style face="normal" font="default" size="100%">O. Chyan*</style></author><author><style face="normal" font="default" size="100%">M. El-Bounani</style></author><author><style face="normal" font="default" size="100%">M. J. Kim</style></author><author><style face="normal" font="default" size="100%">C. T. Wu</style></author><author><style face="normal" font="default" size="100%">L. C. Chen</style></author><author><style face="normal" font="default" size="100%">K. H. Chen</style></author></authors></contributors><titles><title><style face="normal" font="default" size="100%">A 5 nm ruthenium thin film as a directly plate-able copper diffusion barrier</style></title><secondary-title><style face="normal" font="default" size="100%">Appl. Phys. Lett.</style></secondary-title></titles><dates><year><style  face="normal" font="default" size="100%">2005</style></year></dates><volume><style face="normal" font="default" size="100%">86</style></volume><pages><style face="normal" font="default" size="100%">083104-(1-3)</style></pages></record></records></xml>